Pressure-assisted soldering of copper using porous metal-reinforced Sn58Bi solder
نویسندگان
چکیده
In this study, porous metals (Ni, Cu) with the porosity of 110 and 500 ppi were, respectively, added into SnBi solder joint to obtain SnBi@P–Cu SnBi@P–Ni composite joints. To ensure bonding quality between layers Cu substrates, a low pressure 0.1 MPa was conducted during soldering process. The microstructure shear behavior joints were investigated. With addition metals, microstructures are mainly composed matrix. As P–Cu P–Ni increases ppi, concentration matrix decreases sharply in cross-sectional present uniform morphology P-metals intermetallic compound (IMC). Here IMC is Cu6Sn5 joint, but Cu)3Sn4 (Cu, Ni)6Sn5 joint. strength significantly metals. average SnBi@110P–Cu reaches 85.28 MPa, which highest among investigated
منابع مشابه
Solder doped polycaprolactone scaffold enables reproducible laser tissue soldering.
BACKGROUND AND OBJECTIVES In this in vitro feasibility study we analyzed tissue fusion using bovine serum albumin (BSA) and Indocyanine green (ICG) doped polycaprolactone (PCL) scaffolds in combination with a diode laser as energy source while focusing on the influence of irradiation power and albumin concentration on the resulting tensile strength and induced tissue damage. MATERIALS AND MET...
متن کاملEffect of Ag Nanopowders on Microstructure, Hardness and Elastic Modulus of Sn-bi Solders
Article history: Received: 14.3.2013. Received in revised form: 23.12.2013. Accepted: 23.12.2013. This paper presents the microstructure, hardness and elastic modulus of Sn58Bi, Sn57Bi1Ag and Ag nanopowders reinforced Sn58Bi composite solders. Microstructural observations reveal that the Ag nanopowders reinforced Sn58Bi composite solders have smaller grains of Ag3Sn and a more uniform Ag3Sn dis...
متن کاملMicrostructural development in a rapidly cooled eutectic Sn–3.5% Ag solder reinforced with copper powder
Experiments using eutectic Sn–3.5% Ag solder paste were conducted with the objective of examining the conjoint influence of copper particles addition and rapid cooling on microstructural development. The composite solder mixture was made by thoroughly mixing a pre-weighed amount of copper particles with a commercial Sn–3.5% Ag solder paste. The experiments were quite similar to the heating and ...
متن کاملSynthesis of Different Copper Oxide Nano-Structures From Direct Thermal Decomposition of Porous Copper(ΙΙ) Metal-Organic Framework Precursors
Copper oxide nanostructures have been successfully synthesized via one-step solid-state thermolysis of two metal-organic frameworks, [Cu3(btc)2] (1) and [Cu(tpa).(dmf)] (2), (btc = benzene-1,3,5-tricarboxylate, tpa = therephtalic acid = 1,4-benzendicarboxylic acid and dmf = dimethyl formamide) under air atmosphere at 400, 500, and 600°C. It has also been found that the reaction temperature pla...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of Materials Science: Materials in Electronics
سال: 2021
ISSN: ['1573-482X', '0957-4522']
DOI: https://doi.org/10.1007/s10854-021-06412-5