Pressure-assisted soldering of copper using porous metal-reinforced Sn58Bi solder

نویسندگان

چکیده

In this study, porous metals (Ni, Cu) with the porosity of 110 and 500 ppi were, respectively, added into SnBi solder joint to obtain SnBi@P–Cu SnBi@P–Ni composite joints. To ensure bonding quality between layers Cu substrates, a low pressure 0.1 MPa was conducted during soldering process. The microstructure shear behavior joints were investigated. With addition metals, microstructures are mainly composed matrix. As P–Cu P–Ni increases ppi, concentration matrix decreases sharply in cross-sectional present uniform morphology P-metals intermetallic compound (IMC). Here IMC is Cu6Sn5 joint, but Cu)3Sn4 (Cu, Ni)6Sn5 joint. strength significantly metals. average SnBi@110P–Cu reaches 85.28 MPa, which highest among investigated

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ژورنال

عنوان ژورنال: Journal of Materials Science: Materials in Electronics

سال: 2021

ISSN: ['1573-482X', '0957-4522']

DOI: https://doi.org/10.1007/s10854-021-06412-5